Amkor will offer TSMC's advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S..
1 day ago

TSMC and Amkor are working to bring chip packaging technology to the US, with Taiwan's giant Arizona facility playing a significant role.
1 day ago

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, has unveiled the.
5 days ago

TSMC, Micron, and ASE are working on deals to secure old display panel plants in Taiwan, and convert them to CoWoS advanced semiconductor packaging plants.
3 weeks ago

HPC News Bytes Podcast 20240909: AI vs. Copyright, TSMC's CoWoS Capacity, Intel's 18A Fab, an RFP for the Future of HPC ¡P share ¡P share ¡P share ¡P share ¡P email.
4 weeks ago

A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies.
3 weeks ago

In mid-August, TSMC had signed a contract with panel manufacturer Innolux to purchase its plant and facilities located in southern Taiwan, eyeing to f...
1 week ago

This is what 2.5D advanced packaging (CoWoS) looks like, with ASE showing off an incredible model in Taiwan of how the components are bound together.
1 week ago

Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies...
4 days ago

GUC's 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several HPC solution providers.
1 week ago