The production capacity of CoWoS packaging technology has become a significant bottleneck in AI chip output over the past year.
7 months ago

TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026.
4 months ago

TSMC halts construction of CoWoS plant in Taiwan after 'archaeological ruins' discovered ... TSMC has been forced to halt construction work at its CoWoS (Chip-on-...
3 months ago

Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus ... Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole...
3 months ago

AMD & NVIDIA have reportedly reserved TSMC's entire CoWoS production for the next two years as both firms aggressively compete in the AI race.
4 months ago

SANTA CLARA, CA, Apr. 24, 2024 ¡V TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies...
5 months ago

TSMC has acted to boost CoWoS monthly production capacity by 20% from the new year in response to a flood of orders from Nvidia, AMD, Apple, Broadcom,...
10 months ago

Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum...
6 months ago

TSMC announced that they are developing the means of building super-sized interposers that can reach over 8x the reticle limit.
5 months ago

The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60000 wafers per month in 2025,...
1 month ago