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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Tom's Hardware
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty

DIGITIMES Asia
The company's latest projections now target monthly CoWoS capacity of approximately 35,000 units for 2024, 75,000 units for 2025, and 135,000 units for 2026 -...
2 weeks ago

TSMC To Significantly Upscale ˇ§CoWoSˇ¨ Production Within The Upcoming Quarters, Reaching Up To 130,000 Monthly Output By 2026

Wccftech
TSMC is "rushing" towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain.
1 week ago

[News] TSMC Reportedly Slows Down CoWoS Capacity Expansion for 2026

TrendForce
TSMC is also reportedly negotiating to acquire a second facility from Innolux. Meanwhile, its Chiayi fab is targeting equipment delivery by the end of 2025 and...
2 weeks ago

TSMC could build CoWoS advanced packaging plants in the US and Japan because of AI demand

TweakTown
TSMC is considering building new CoWoS advanced packaging plants in the US and Japan due to strong demand, particularly for AI chips from NVIDIA.
3 weeks ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Yahoo
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

MSN
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

TSMC To Double Production Based On Nvidia Numbers And Overall Demand

Forbes
NANJING, CHINA - JUNE 6, 2024 - Visitors visit [+][-] TSMC booth at the 2024 World Semiconductor Congress in Nanjing, East China's Jiangsu province, June 6,...
4 weeks ago

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

TrendForce
According to a report from TechNews, citing Tom's Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large ...
5 days ago

TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027

DIGITIMES Asia
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027,...
2 days ago