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Nvidia shifts to CoWoS-L packaging for Blackwell GPU production ramp-up

Tom's Hardware
As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging...
4 days ago

[News] TSMC Faces Order Cut Fears as AMD, Broadcom, and NVIDIA Reportedly Slash CoWoS-S Demand

TrendForce
Ahead of TSMC's earnings call on January 16th, market rumors have been circulating that the foundry giant's largest clients are slashing their CoWoS-S...
5 days ago

TSMC maintains CoWoS equipment orders despite Nvidia demand concerns

DIGITIMES Asia
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia.
6 days ago

Nvidia CEO says its advanced packaging technology needs are changing

Reuters
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen...
4 days ago

Nvidia's Blackwell lineup suggests less demand for TSMC's CoWoS-S: Kuo

Seeking Alpha
Nvidia's latest product lineup may reduce demand for CoWoS-S from TSMC. Read more here.
5 days ago

NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs

TweakTown
NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.
3 days ago

Nvidia transitions to advanced CoWoS-L chip packaging, signaling a major shift for TSMC

TechSpot
Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in...
2 days ago

Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L packaging

Tom's Hardware
Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.
5 days ago

Nvidia CEO says its advanced packaging technology needs are changing

Taipei Times
Nvidia Corp's demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, ¥x¿n¹q) remains strong though the kind of technology it needs...
4 days ago

Morgan Stanley: ¡§[TSMC¡¦s] Customers Like AMD And Broadcom Are Releasing CoWoS-S Capacity Due To Weaker Demand,¡¨ Allowing NVIDIA To ¡§Convert This Capacity To CoWoS-L For GB300A Production¡¨

Wccftech
Morgan Stanley notes that, in light of CoWoS-S capacity cancelations, NVIDIA has requested TSMC to convert its spare capacity to CoWoS-L.
5 days ago