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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Tom's Hardware
TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks ... Bigger, better, faster, stronger.
1 month ago

TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty

DIGITIMES Asia
The company's latest projections now target monthly CoWoS capacity of approximately 35,000 units for 2024, 75,000 units for 2025, and 135,000 units for 2026 -...
1 month ago

TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

AnandTech
TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026.
7 months ago

[News] TSMC Faces Order Cut Fears as AMD, Broadcom, and NVIDIA Reportedly Slash CoWoS-S Demand

TrendForce
Ahead of TSMC's earnings call on January 16th, market rumors have been circulating that the foundry giant's largest clients are slashing their CoWoS-S...
1 day ago

TSMC halts construction of CoWoS plant in Taiwan after ¡¥archaeological ruins¡¦ discovered

Data Center Dynamics
TSMC halts construction of CoWoS plant in Taiwan after 'archaeological ruins' discovered ... TSMC has been forced to halt construction work at its CoWoS (Chip-on-...
6 months ago

The Secret Behind TSMC¡¦s CoWoS Packaging Technology¡UIndustry¡U2024-09-11

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During the 2024 Technology Symposium, TSMC unveiled a new iteration of CoWoS called ¡§system-on-wafer¡¨, or SoW. It can produce a massive chip that's about the...
4 months ago

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

Wccftech
TSMC is set to upscale its CoWoS packaging facilities, as the Taiwan giant plans to spend almost US $16 billion on building new facilities.
9 months ago

Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research

DIGITIMES Asia
Due to robust demand for CoWoS and similar packaging capacities, TSMC and ASE (including SPIL) are ramping up their related capacities to meet customers' needs.
2 months ago

TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's

AnandTech
TSMC announced that they are developing the means of building super-sized interposers that can reach over 8x the reticle limit.
8 months ago

Amkor and TSMC team up for advanced packaging in the U.S. ¡X CoWoS and InFo to make AI and HPC CPUs

Tom's Hardware
Amkor will offer TSMC's advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S..
3 months ago