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Nvidia Bongkar New Strategy:Blackwell Technology Ready to modify AI industry!

VOI.ID
Nvidia对台积电高级包装技术的需求仍然很高,尽管所需的技术类型开始发生变化。
9 hours ago

川普上任延續晶片補助？ 台積電：有信心逐步到位

大紀元新聞網
据美国《晶片与科学法案法案》，台积电可获得66亿美元在美国建造3座晶圆厂。不过，全球市场关注美国总统当选人川普是否延续晶片补助。台积电财务长黄仁昭日前强调，在川普...
10 hours ago

TSMC set to build two additional CoWoS facilities

New Electronics
TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).
12 hours ago

台积电再盖两座先进封装厂，投资超2000亿元！

电子工程专辑
台积电冲刺CoWoS先进封装布局，最新传出又要在南科三期盖两座CoWoS新厂，投资金额估逾2000亿元新台币。加计台积电正在嘉科园区如火如荼建置的CoWoS新厂，业界预期，...
13 hours ago

TSMC’s CoWoS-L Technology and Nvidia’s Packaging Shift in 2025

The Vanguard
Nvidia's Move to Advanced Packaging In a significant move, Nvidia is transitioning the production of its Blackwell chips from TSMC's...
14 hours ago

Arm计划涨价300%；台积电回应CoWoS砍单传闻；英诺赛科起诉英飞凌…一周芯闻汇总（1.13-1.19）

电子工程专辑
我是芯片超人花姐，入行20年，有40W+芯片行业粉丝。有很多不方便公开发公众号的，关于芯片买卖、关于资源链接等，我会分享在朋友圈。扫码加我本人微信 一周大事件1、美成熟...
14 hours ago

[News] TSMC Reportedly Building Two More CoWoS Facilities, Debunking Order Cut Rumors

TrendForce
According to a report from Economic Daily News, TSMC plans to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (ST...
15 hours ago

Jensen Huang prioritizes TSMC collaboration over Trump inauguration - CHOSUNBIZ

Chosunbiz
NVIDIA's CEO emphasizes vital partnerships in semiconductor innovation while skipping the inauguration event. By. Chun Byung-soo. Published 2025.01.20.
18 hours ago

传台积电将再建两座CoWoS先进封装厂

QQ News
1月20日消息，据台媒《经济日报》报道称，为应对旺盛的CoWoS先进封装产能需求，传闻台积电计划在南科三期再盖两座CoWoS新厂，投资金额估逾新台币2000亿元。
19 hours ago

Weekly news roundup: Europe's chip ambitions falter; TSMC maintains CoWoS equipment orders

DIGITIMES Asia
These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.
22 hours ago